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In the electronics industry, ultrafine dicyandiamide plays a crucial role. In printed circuit board (PCB) manufacturing, it is used in solder resist layers to enhance insulation, improve adhesion and graphic accuracy; in conformal coatings, it provides moisture, dust, and foreign object protection. In semiconductor packaging, it acts as a curing agent for epoxy molding compounds and underfill materials, improving package strength, optimizing thermal performance, and enhancing connection reliability. In the coating of electronic components, whether capacitors or resistors, it enhances insulation, stabilizes performance, and improves heat dissipation. Through these applications, ultrafine dicyandiamide significantly improves the reliability, stability, and performance of electronic devices, driving continuous progress in the electronics industry.

I. Printed Circuit Board (PCB) Manufacturing

(I) Solder Resist Layer

1. Enhanced Insulation Performance: On PCBs, reliable insulation is needed between different circuit layers to prevent short circuits. Ultrafine dicyandiamide, as a curing agent in solder resist ink, undergoes a crosslinking reaction with the resin, forming a highly dense three-dimensional network structure. This structure effectively prevents the abnormal conduction of current between different lines, ensuring the independent operation of each line even in high-voltage, high-frequency operating environments. For example, in the PCB of a server motherboard, a large number of high-speed signal lines are densely distributed. Using a solder resist layer containing ultrafine dicyandiamide ensures the stability and accuracy of data transmission, avoiding data errors or system failures caused by leakage current between lines.

2. Improved Adhesion and Chemical Resistance: PCBs undergo various chemical processing steps during manufacturing, such as etching and cleaning, and may subsequently come into contact with fluxes and cleaning agents. The solder resist layer cured with ultrafine dicyandiamide exhibits excellent adhesion to the PCB substrate and is not easily detached during chemical processing. At the same time, its high chemical stability after curing can resist the erosion of various chemicals, ensuring that the solder resist layer maintains good performance throughout the PCB's life cycle. Taking PCBs in automotive electronics as an example, in harsh environments such as engine compartments, they must withstand high temperatures, high humidity, and various corrosive gases. A solder resist layer containing ultrafine dicyandiamide can effectively protect the lines and extend the service life of the PCB.

3. Precise Graphics: With the development of electronic products towards miniaturization and high performance, PCB circuit designs are becoming increasingly refined, requiring extremely high precision in solder resist layer graphics. The small particle size of ultrafine dicyandiamide gives it good dispersibility in the ink system, enabling high-precision photolithographic imaging. Through photolithography, solder resist patterns with clear edges and precise dimensions can be formed on the PCB, ensuring that the insulation distance between lines meets the design requirements and meets the manufacturing needs of high-density interconnect (HDI) PCBs, such as PCBs in thin and portable devices such as smartphones and tablets.

(II) Conformal Coating

1. Moisture and Salt Spray Corrosion Protection: In some electronic devices used in humid environments or coastal areas, such as ocean monitoring instruments and outdoor communication base stations, PCBs face the severe challenges of water vapor and salt spray. A conformal coating containing ultrafine dicyandiamide can form a uniform and continuous protective film on the surface of the PCB. Its cured structure is dense, making it difficult for water molecules and salts to penetrate, effectively preventing the oxidation and corrosion of metal lines on the PCB. Experiments have shown that PCBs treated with this conformal coating remain intact after being exposed in a salt spray test chamber for thousands of hours, greatly improving the reliability of electronic devices in harsh environments.

2. Dust and Foreign Object Protection: During the production, transportation, and use of electronic devices, they inevitably come into contact with dust, fibers, and other foreign objects. Once these foreign objects land on the PCB, they may cause short circuits or affect the heat dissipation of electronic components. The ultrafine dicyandiamide in the conformal coating gives the coating a smooth surface, reducing the adhesion of dust and other foreign objects. At the same time, the flexibility of the coating ensures that it remains intact even when the PCB is subjected to vibration or impact, continuously providing protection for the PCB and ensuring the stable operation of electronic devices, such as industrial control equipment and aerospace electronic systems, which have extremely high reliability requirements.

II. Semiconductor Packaging

(I) Epoxy Molding Compound (EMC)

1. Improved Packaging Strength and Reliability: During the packaging process of semiconductor chips, EMC is used to isolate the chip from the external environment and provide mechanical support. Ultrafine dicyandiamide, as a key curing agent in EMC, can react rapidly with epoxy resin to form a high-strength cured product. This not only enhances the overall mechanical strength of the package, effectively resisting external impacts during transportation, installation, and use, preventing cracking and delamination between the chip and the packaging material. For example, in the semiconductor chip packaging in automotive engine control units (ECUs), it must withstand the intense vibrations and high temperatures generated by engine operation. EMC containing ultrafine dicyandiamide ensures that the chip can operate stably for a long time under harsh conditions.

2. Optimized Thermal Performance: When the chip is working, it generates a large amount of heat, and good thermal management is crucial for chip performance and lifespan. The EMC cured with ultrafine dicyandiamide has a low coefficient of thermal expansion, which can better match the coefficient of thermal expansion of the chip and substrate. This helps to reduce chip damage caused by thermal stress during temperature changes. At the same time, the thermal conductivity of EMC can be improved by adding specific fillers and optimizing the formula, thereby improving the heat dissipation efficiency of the chip and ensuring the temperature stability of the chip during high-performance operation, such as high-performance computing chips and 5G communication chips, which have extremely high requirements for heat dissipation.

3. Improved Packaging Processability: In the molding process of semiconductor packaging, EMC needs to have good fluidity and filling properties to ensure that it can completely encapsulate the chip and fill the tiny gaps. The small particle size of ultrafine dicyandiamide ensures its uniform distribution in the EMC system without affecting the fluidity of the system. At the same time, its curing reaction is controllable, and the curing conditions (such as temperature and time) can be adjusted to adapt to different packaging process requirements, improving packaging production efficiency and yield, and meeting the needs of large-scale semiconductor production.

(II) Underfill Material

1. Enhanced Chip-to-Substrate Connection Reliability: In flip-chip packaging technology, underfill is used to fill the gap between the chip and the substrate to enhance the connection strength. Ultrafine dicyandiamide, as a curing agent for underfill, allows the adhesive to form a tough and flexible colloid after curing. This effectively disperses stress caused by the difference in thermal expansion coefficients between the chip and the substrate, preventing solder joint fatigue cracking during thermal cycling and improving the reliability of the chip-to-substrate connection. For example, in the flash memory chip packaging of solid-state drives (SSDs), frequent read and write operations cause the chip to heat up. The ultrafine dicyandiamide in the underfill ensures that the connection between the chip and the substrate remains stable under long-term thermal cycling, ensuring data storage and transmission security.

2. Improved Signal Transmission Integrity: With the increasing demand for high-speed signal transmission in electronic devices, the electrical performance of underfill has become crucial. The underfill containing ultrafine dicyandiamide has low dielectric constant and low dielectric loss characteristics after curing, which helps reduce signal attenuation and distortion during transmission, ensuring that high-speed signals can be accurately and quickly transmitted between the chip and the substrate. In high-speed communication equipment, such as switches and routers, this performance plays a key role in ensuring high-speed and stable data transmission.

III. Electronic Component Coatings

(I) Capacitors

1. Improved Insulation Performance and Stability: Capacitors are commonly used energy storage components in electronic devices, and their insulation performance directly affects the reliability of the device. Coating the dielectric material surface of the capacitor with a coating containing ultrafine dicyandiamide can further improve its insulation performance. After curing, the ultrafine dicyandiamide and the resin in the coating form an insulating layer that effectively blocks leakage current and reduces capacitor loss. At the same time, this coating can also enhance the chemical stability of the dielectric material, preventing its performance degradation due to environmental factors during long-term use, ensuring that the capacitor can stably store and release charge under different working conditions, such as capacitors in power filter circuits, good insulation performance can ensure the stability of the power supply output.

2. Enhanced Voltage Withstanding Performance: In some high-voltage applications, such as power electronic devices and pulse generators, capacitors need to withstand high voltages. The coating containing ultrafine dicyandiamide can improve the voltage-withstanding performance of the capacitor. By forming a uniform and dense insulating protective layer on the dielectric surface, it can effectively suppress corona discharge and partial discharge phenomena, preventing the capacitor from being broken down under high voltage, improving the capacitor's operating voltage range and reliability.

(II) Resistors

1. Protecting the Resistor Body and Stabilizing the Resistance Value: The resistance value stability of a resistor is crucial to the performance of an electronic circuit. Ultrafine dicyandiamide is used in the coating material of the resistor to form a strong protective film on the surface of the resistor body. This film can prevent the resistor body from being affected by external environmental factors (such as moisture, chemical gases, mechanical wear, etc.), avoiding oxidation and corrosion of the resistor body, thereby ensuring that the resistance value remains stable during long-term use. For example, in precision measuring instruments, even small changes in resistance value can lead to large errors in measurement results. The coating containing ultrafine dicyandiamide can effectively ensure the accuracy and reliability of the resistor.

2. Improved Heat Dissipation Performance: Resistors generate heat during operation, and good heat dissipation performance helps reduce the operating temperature of the resistor, improving its stability and lifespan. The ultrafine dicyandiamide in the coating can optimize the thermal conductivity of the coating by synergistically acting with other functional fillers. This allows the heat generated by the resistor to be more effectively dissipated into the surrounding environment, avoiding resistance value drift due to excessive temperature, ensuring that the resistor can still operate normally under high-power operating conditions, such as resistors in power amplifiers, which need good heat dissipation performance to ensure circuit stability.